Thermal Management:

As the functionality of the Circuits increases so does the generated heat. It becomes critical to take the heat away from the circuit board for it to function properly. FTG offers various options for removing heat from the circuit boards. These include:

• Materials with higher Thermal conductivity
• Pre-bonded / Post-bonded Metal heat sinks 
  • Copper cores and heat sinks 
  • Aluminum  cores
  • Aluminum heat sinks with / without thermal vias
  • Brass heat sinks
• Channels to circulate cooling Liquids 
• Nickel plated rails
• Thermal via farm
• Coin  – Press fit &  Embedded